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L293E(1993) Просмотр технического описания (PDF) - STMicroelectronics

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L293E
(Rev.:1993)
ST-Microelectronics
STMicroelectronics ST-Microelectronics
L293E Datasheet PDF : 12 Pages
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L293B - L293E
MOUNTING INSTRUCTIONS
The Rth j-amb of the L293B and the L293E can be re-
duced by soldering the GND pins to a suitable cop-
per area of the printed circuit board as shown in fig-
ure 12 or to an external heatsink (figure 13).
Figure 12 :Example of P.C. Board Copper
Area which is Used as Heatsink
During soldering the pins temperature must not ex-
ceed 260oC and the soldering time must not be
longer than 12 seconds.
The external heatsink or printed circuit copper area
must be connected to electrical ground.
Figure 13 :External Heatsink Mounting Ex-
ample (Rth = 30oC/W)
9/12

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