ISD1700 Просмотр технического описания (PDF) - Winbond

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ISD1700

Multi-Message Single-Chip Voice Record & Playback Devices

Winbond 

ISD1700 SERIES

y Temperature options:

o Commercial: 0°C to +50°C (die); 0°C to +70°C (packaged units)

o Industrial: -40°C to +85°C (packaged units)

y Packaging types: available in die, PDIP, SOIC and TSOP

y Package option: Lead-free packaged units

3 BLOCK DIAGRAM

ROSC

AnaIn

MIC+

MIC-

AGC

Internal

Clock

Timing

Sampling

Clock

AnaIn

Amp

AGC

Amp

Anti-

Aliasing

Filter

Automatic

Gain Control

Nonvolatile

Multi-Level Storage

Array

Smoothing

Filter

Volume

Control

Amp

Amp

Power Conditioning

Device Control

SPI Interface

AUD /

AUX

SP+

SP-

VCCA VSSA VCCP VSSP1 VSSP2 VSSD VCCD

REC PLAY ERASE FWD FT RESET VOL INT/RDY LED SS SCLK MOSI MISO

Publication Release Date: January 23, 2007

-5-

Revision 1.3-S2

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