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JANTX2N6847U Просмотр технического описания (PDF) - International Rectifier

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JANTX2N6847U Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
IRFE9220
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
BVDSS
BVDSS/TJ
RDS(on)
VGS(th)
gfs
IDSS
Parameter
Drain-to-Source Breakdown Voltage
Temperature Coefficient of Breakdown
Voltage
Static Drain-to-Source On-State
Resistance
Gate Threshold Voltage
Forward Transconductance
Zero Gate Voltage Drain Current
IGSS
IGSS
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
LS + LD
Gate-to-Source Leakage Forward
Gate-to-Source Leakage Reverse
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain (‘Miller’) Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Inductance
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Min Typ Max Units
-200 — — V
— -0.22 — V/°C
— — 1.5
— 1.725
-2.0 — - 4.0 V
1.0 — — S ( )
— — -25
— — -250 µA
— -100 nA
— — 100
— — 15
— — 3.2 nC
— — 8.4
— — 50
— — 70
ns
— — 40
— — 50
— 6.1 — nH
— 330
— 100 — pF
— 33 —
Test Conditions
VGS = 0V, ID = -1.0mA
Reference to 25°C, ID = -1.0mA
VGS = -10V, ID = -1.5A
VGS = -10V, ID = -2.1A
VDS = VGS, ID = -250µA
VDS > -15V, IDS =-1.5A
VDS= -160V, VGS= 0V
VDS =-160V
VGS = 0V, TJ = 125°C
VGS =-20V
VGS =20V
VGS =-10V, ID= -2.1A
VDS =-100V
VDD =-100V, ID = -2.1A,
RG =7.5
Measured from the center of
drain pad to center of source
pad
VGS = 0V, VDS = -25V
f = 1.0MHz
Source-Drain Diode Ratings and Characteristics
Parameter
Min Typ Max Units
IS Continuous Source Current (Body Diode)
ISM Pulse Source Current (Body Diode)
— — -2.1 A
— — -8.4
Test Conditions
VSD
trr
QRR
ton
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn-On Time
— — -4.8 V
Tj = 25°C, IS = -2.1A, VGS = 0V
— — 300 nS Tj = 25°C, IF = -2.1A, di/dt -100A/µs
— — 3.0 µc
VDD -50V
Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.
Thermal Resistance
Parameter
RthJC
RthJ-PCB
Junction to Case
Junction to PC Board
For footnotes refer to the last page
2
Min Typ Max Units
— — 9.1 °C/W
— — 26" " "
Test Conditions
Soldered to a copper clad PC board
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