HSDL-3200 Просмотр технического описания (PDF) - HP => Agilent Technologies

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HSDL-3200

IrDA® Data 1.4 Compliant 115.2 Kb/s Infrared Transceiver

HP => Agilent Technologies 

Moisture Proof Packaging

The HSDL-3200 is shipped in

moisture proof packaging. Once

opened, moisture absorption

begins.

Solder Pad, Mask and Metal Stencil

STENCIL

APERTURE

METAL STENCIL

FOR SOLDER PASTE

PRINTING

Recommended Storage Conditions

Storage Temperature 10°C to 30°C

Relative Humidity

Below 60%

Time from Unsealing to Soldering

After removal from the bag, the

parts should be soldered within

2 days if stored at the recom-

mended storage conditions. If

times longer than 2 days are

needed, the parts must be stored

in a dry box.

SOLDER

MASK

LAND

PATTERN

PCB

HSDL-3200#021 Recommended Land Pattern (Front Option)

Baking

If the parts are not stored in dry

conditions, they must be baked

before reflow to prevent damage

to the parts.

In Reels

In Bulk

60°C, t ≥ 48 hours

100°C, t ≥ 4 hours

125°C, T ≥ 2 hours

150°C, T ≥ 1 hour

Tx LENS

Rx LENS

e

d SHIELD SOLDER PAD

g

b

Y

a

X

theta

DIMENSION mm

INCHES

a

1.75

0.069

b

0.60

0.024

f

c (PITCH) 0.95

0.037

d

1.25

0.049

e

2.70

0.106

f

2.20

0.087

g

2.28

0.089

Baking should only be done

once.

FIDUCIAL

8x PAD

c

FIDUCIAL

HSDL-3200-028 Recommended Land Pattern (Top Options)

2.20

1.45

;;;;;;;;; 1.275

0.9

MOUNTING CENTER

0.575

;;;;;;;;;;;1.60

0.60

PITCH 7 x 0.95

3.625

9

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