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HMC543(V02) Просмотр технического описания (PDF) - Hittite Microwave

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HMC543
(Rev.:V02)
Hittite
Hittite Microwave Hittite
HMC543 Datasheet PDF : 6 Pages
1 2 3 4 5 6
v02.0209
Outline Drawing
3
HMC543
22.5° MMIC 4-BIT DIGITAL
PHASE SHIFTER, 8 - 12 GHz
Die Packaging Information [1]
Standard
Alternate
GP-2 (Gel Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS IN INCHES (MILLIMETERS)
2. DIE THICKNESS IS 0.007
3. TYPICAL BOND PAD IS 0.004 SQUARE
4. BACKSIDE METALLIZATION: GOLD
5. BACKSIDE METAL IS GROUND
6. BOND PADS METALLIZATION: GOLD
7. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS
8. OVERALL DIE SIZE ±0.002
Application Circuit
3 - 12
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com

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