HMC136 Просмотр технического описания (PDF) - Hittite Microwave
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HMC136 Datasheet PDF : 4 Pages
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v01.0300
MICROWAVE CORPORATION
HMC136
GaAs MMIC BI-PHASE
MODULATOR, 4 - 8 GHz
Suggested TTL Driver for a Bi-Phase Modulator
+5 Vdc
+2.5 Vdc
VCC
.01 uF
VCC
HCT04
TTL
HC04 VA
*R1
V Z = 2V
GND
IA
GND
MODULATOR
I, Q PORTS
0.6V
2.2K
.01 uF
Notes
-2.5 Vdc
HITTITE
MODULATOR
1. VAAlternates Between
+ 2.4 Vdc
2. HCT04 and HC04 are QMOS HEX
Inverters.
6
± I = 2.4 - 0.6 = ± 5 mA
A
360 Ohm
*R1 =300 to 620 ± 2% Select R1 To
Supply ±3 to ±6 mA to the IF Port.
Outline Drawing
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. TYPICAL BOND PAD IS .004” SQUARE.
3. BOND PAD SPACING IS .006” CENTER
TO CENTER.
4. BACKSIDE METALIZATION: GOLD.
5. BACKSIDE METAL IS GROUND.
6. BOND PAD METALIZATION: GOLD.
7. CONNECTION NOT REQUIRED FOR
UNLABELED BOND PADS.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
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