HA-2540 Просмотр технического описания (PDF) - Intersil

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HA-2540

400MHz, Fast Settling Operational Amplifier

Intersil 

HA-2540

DIE DIMENSIONS:

62 mils x 76 mils x 19 mils

1575 µmx 1930µm x 483µm

METALLIZATION:

Type: Al, 1% Cu

Thickness: 16kÅ ±2kÅ

PASSIVATION:

Type: Nitride (Si3N4) over Silox (SiO2, 5% Phos.)

Silox Thickness: 12kÅ ±2kÅ

Nitride Thickness: 3.5kÅ ±1.5kÅ

Metallization Mask Layout

SUBSTRATE POTENTIAL (Powered Up):

V-

TRANSISTOR COUNT:

30

PROCESS:

Bipolar Dielectric Isolation

HA-2540

V+ OUTPUT

V-

-IN

+IN

All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.

Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-

out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and

reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result

from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see web site http://www.intersil.com

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