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HI-1573 Просмотр технического описания (PDF) - Holt Integrated Circuits

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Компоненты Описание
Список матч
HI-1573
HOLTIC
Holt Integrated Circuits HOLTIC
HI-1573 Datasheet PDF : 11 Pages
First Prev 11
PACKAGE DIMENSIONS
44-PIN PLASTIC CHIP-SCALE PACKAGE (QFN)
(07..20706)BSC
7.00
(0.276)
BSC
Top View
5.50 ± 0.050
(0.217 ± 0.002)
millimeters (inches)
Package Type: 44PCS
5.50 ± 0.050
(0.217 ± 0.002)
Bottom
View
0.50
(0.0197)
BSC
0.25 ± 0.050
(0.010 ± 0.002)
1.00
(0.039)
max
0.200
(0.008)
typ
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
Electrically isolated heat
sink pad on bottom of
package
Connect to any ground or
power plane for optimum
thermal dissipation
0.400 ± 0.050
(0.016 ± 0.002)
HOLT INTEGRATED CIRCUITS
11

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