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HDMI05-CL02F3
Figure 19. Footprint
Copper pad Diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
Solder stencil opening :
220 µm recommended
Figure 20. Marking
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
Package information
E
xxz
y ww
Figure 21. Flip Chip tape and reel specification
4.0 ± 0.1
Ø 1.5 ± 0.1
0.69 ± 0.05
All dimensions in mm
1.24
4.0 ± 0.1
User direction of unreeling
Doc ID 15516 Rev 2
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