HDMIULC6-2M6 Просмотр технического описания (PDF) - STMicroelectronics

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HDMIULC6-2M6

Ultra large bandwidth ESD protection

STMicroelectronics 

Characteristics

1

Characteristics

Figure 1. Functional diagram

HDMIULC6-2x6

I/O1 1

6 I/O1 I/O1 1

6 I/O1

GND 2

I/O2 3

5 VBUS GND 2

4 I/O2 I/O2 3

5 VBUS

4 I/O2

µQFN 6 leads

SOT666

When used with a HDMI application, Pin 5 should not be connected to

protect against backdrive current flow on data lines.

Table 1.

Symbol

Absolute ratings

Parameter

Value

Unit

IEC 61000-4-2 air discharge

±15

VPP Peak pulse voltage

IEC 61000-4-2 contact discharge

±15

kV

MIL STD883G-Method 3015-7

±25

Tstg Storage temperature range

Tj Maximum junction temperature

TL Lead solder temperature (10 seconds duration)

-55 to +150

°C

125

°C

260

°C

Table 2. Electrical characteristics (Tamb = 25 °C)

Symbol

Parameter

Test Conditions

Value

Unit

Min. Typ. Max

IRM Leakage current

VRM = 5 V

VBR

Breakdown voltage between VBUS

and GND

IR = 1 mA

0.5 µA

6

V

VCL Clamping voltage

IPP = 1 A, tp = 8/20 µs

Any I/O pin to GND

IPP = 5 A, tp = 8/20 µs

Any I/O pin to GND

12 V

17 V

Ci/o-GND Capacitance between I/O and GND VR = 0 V, F = 825 MHz

ΔCi/o-GND

Capacitance variation between I/O

and GND

VR = 0 V, F = 1 MHz

0.85 pF

0.02

pF

Ci/o-i/o Capacitance between I/O

VR = 0 V, F = 825 MHz

0.5 pF

2/17

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