HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6616-B
Issued Date : 1993.09.24
Revised Date : 2000.12.01
Page No. : 3/4
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
IR Reflow Profile
10+/-2 sec
40+/-20 sec
150+/-30
50
100
150
200
250
300
Time(sec)
Temperature Profile for Dip Soldering
300
10+/-2 sec
250
200
150
100
120+/-20 sec
50
0
0
50
100 150 200 250 300 350
Time(sec)
HSMC Product Specification