datasheetbank_Logo
Технический паспорт Поисковая и бесплатно техническое описание Скачать

GM1117-1.5 Просмотр технического описания (PDF) - Gamma Microelectronics Inc.

Номер в каталоге
Компоненты Описание
Список матч
GM1117-1.5
GAMMA
Gamma Microelectronics Inc. GAMMA
GM1117-1.5 Datasheet PDF : 13 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
AA
MICROELECTRONICS
Power Management
GM1117
1.0A LOW DROPOUT PRECISION LINEAR REGULATORS
The thermal characteristics of an IC depend four fac-
tors:
1. Maximum Ambient Temperature TA (°C)
2. Power Dissipation PD (Watts)
3. Maximum Junction Temperature TJ (°C)
4. Thermal Resistance Junction to ambient RQJA
(°C/W)
The relationship of these four factors is expressed by
equation (1):
TJ = TA + PD X RQJA ........(1)
Maximum ambient temperature and power dissipa-
tion are determined by the design while the maximum
junction temperature and thermal resistance depend
on the manufacturer and the package type.
The maximum power dissipation for a regulator is ex-
pressed by equation (2):
PD(max) = { VIN(max)- VOUT(min) } IOUT(max) + VIN(max)IQ ........(2)
where:
VIN(max) is the maximum input voltage,
VOUT(min) is the minimum output voltage,
IOUT(max) is the maximum output current
IQ is the maximum quiescent current at IOUT(max).
A heat sink effectively increases the surface area of
the package to improve the flow of heat away from
the IC into the air. Each material in the heat flow path
between the IC and the environment has a thermal re-
sistance. Like series electrical resistances, these re-
, sistance are summed to determine RQJA the total
thermal resistance between the junction and the air.
This is expressed by equation (3):
RQJA = RQJC + RQCS+ RQSA ........(3)
Where all of the following are in °C/W:
RQJC is thermal resistance of junction to case,
RQCS is thermal resistance of case to heat sink,
RQSA is thermal resistance of heat sink to ambient air
The value for RQJA is calculated using equation (3)
and the result can be substituted in equation (1). The
value for RQJC is 3.5°C/W for a given package type
based on an average die size. For a high current reg-
ulator such as the GM1117 the majority of the heat is
generated in the power transistor section.
8

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]