MC14514BDW Просмотр технического описания (PDF) - Motorola => Freescale
Номер в каталоге
Компоненты Описание
Список матч
MC14514BDW Datasheet PDF : 8 Pages
| |||
24
1
A
F
D
G
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 623–05
ISSUE M
13
B
12
SEATING
C
PLANE
N
K
L
M
J
NOTES:
1. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
2. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION (WHEN FORMED
PARALLEL).
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 31.24 32.77 1.230 1.290
B 12.70 15.49 0.500 0.610
C 4.06 5.59 0.160 0.220
D 0.41 0.51 0.016 0.020
F 1.27 1.52 0.050 0.060
G
2.54 BSC
0.100 BSC
J 0.20 0.30 0.008 0.012
K 3.18 4.06 0.125 0.160
L
15.24 BSC
0.600 BSC
M 0 _ 15_ 0_ 15_
N 0.51 1.27 0.020 0.050
P SUFFIX
PLASTIC DIP PACKAGE
CASE 709–02
ISSUE C
24
13
B
1
12
A
H
G
F
D
C
N
K
SEATING
PLANE
L
MJ
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 31.37 32.13 1.235 1.265
B 13.72 14.22 0.540 0.560
C 3.94 5.08 0.155 0.200
D 0.36 0.56 0.014 0.022
F 1.02 1.52 0.040 0.060
G
2.54 BSC
0.100 BSC
H 1.65 2.03 0.065 0.080
J 0.20 0.38 0.008 0.015
K 2.92 3.43 0.115 0.135
L
15.24 BSC
0.600 BSC
M 0 _ 15_ 0 _ 15_
N 0.51 1.02 0.020 0.040
MOTOROLA CMOS LOGIC DATA
MC14514B MC14515B
391
Share Link: 