FMP1617CC0-F60E Просмотр технического описания (PDF) - FIDELIX
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FMP1617CC0-F60E Datasheet PDF : 10 Pages
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FMP1617CC0(7)
PACKAGE DIMENSION
48 BALL FINE PITCH BGA(0.75mm ball pitch)
Top View
B
#A1
CMOS LPRAM
Unit : millimeters
Bottom View
B
B1
654
A
B
C
D
32
A1 INDEX MARK
0.05
0.05
1
E
F
G
H
Side View
D
C
-
Min
Typ
Max
A
-
0.75
-
B
5.90
6.00
6.10
B1
-
3.75
-
C
7.90
8.00
8.10
C1
-
5.25
-
D
0.30
0.35
0.40
E
-
1.10
1.20
E1
-
0.85
-
E2
0.20
0.25
0.30
Y
-
-
0.08
B/2
Detail A
A
Y
NOTES.
1. Bump counts : 48(8row x 6column)
2. Bump pitch : (x,y)=(0.75 x 0.75)(typ.)
3. All tolerance are +/-0.050 unless
otherwise specified.
4. Typ : Typical
5. Y is coplanarity : 0.08(Max)
10
Revision 0.1
Jun. 2006
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