FAN2564(2009) Просмотр технического описания (PDF) - Fairchild Semiconductor

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FAN2564
(Rev.:2009)

300mA Low VIN LDO for Digital Applications

Fairchild Semiconductor 

Layout Considerations

CIN and COUT should be placed close to the device for

optimal transient response and device behavior. A dedi-

cated ground plane is recommended for proper GND

connection.

Figure 23. Assembly Diagram

Figure 25. Bottom Layer

Figure 24. Top Layer

© 2007 Fairchild Semiconductor Corporation

FAN2564 • Rev. 1.0.1

10

www.fairchildsemi.com

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