EVQPLA Просмотр технического описания (PDF) - Panasonic Corporation
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EVQPLA Datasheet PDF : 3 Pages
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Light Touch Switches/EVQPL
■ Recommended Reflow Soldering Conditions
MAX.
260
230
180
150
Fan or Normal Temp.
● Embossed Carrier Taping
Tape width=12.0 mm
t1
Feeding hole Chip pocket
φD0
P2 P0
A
(Normal Temp.)
90±30
Soldering Time (s)
40±10
Chip component
t2
P1 Tape running direction
Part No.
EVQPL
Height
0.8/1.5
A
B
W
F
E
P1
5.0±0.2 5.0±0.2 12.0±0.3 5.5±0.1 1.75±0.10 8.0±0.1
P2
2.0±0.1
P0
4.0±0.1
D0 Dia.
1.5+–00.1
Unit: mm
t1
t2
0.35±0.05 1.0/1.7±0.2
● Standard Reel Dimensions in mm (not to scale)
T
E
C
r
D
A
Wt
Item
A
B
C
D
E
Rate (mm) φ370.0±2.0 φ50.0 min. φ13.0±0.5 φ21.0±1.0 2.0±0.5
Item
W
Rate (mm) 14.0±1.5
T
t
r
—
1.0 to 3.0 1.0±0.5
■ Recommended Shape of Test Pole
for Reflow
soldering
type
φ1.0
R0.2±0.05
■ Recommended Operating Conditions
0.3 mm max.
Switch
Leaning angle range
Test pole
90 °±4 °
(vertical direction)
Mounting surface
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
– ES82 –
00 Sep. 2010
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