TGA1141 Просмотр технического описания (PDF) - TriQuint Semiconductor
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TGA1141 Datasheet PDF : 9 Pages
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Not Recommended for New Designs
Product Data Sheet
August 5, 2008
TGA1141
Chip Assembly and Bonding Diagram
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
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TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com
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