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CY7C024AV-15AI(2005) Просмотр технического описания (PDF) - Cypress Semiconductor

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CY7C024AV-15AI
(Rev.:2005)
Cypress
Cypress Semiconductor Cypress
CY7C024AV-15AI Datasheet PDF : 19 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
CY7C024AV/025AV/026AV
CY7C0241AV/0251AV/036AV
Switching Characteristics Over the Operating Range (continued)[19]
Parameter
Description
tSD
tHD
tHZWE[22, 23]
tLZWE[22, 23]
tWDD[24]
tDDD[24]
Busy Timing[25]
Data Set-up to Write End
Data Hold From Write End
R/W LOW to High Z
R/W HIGH to Low Z
Write Pulse to Data Delay
Write Data Valid to Read Data Valid
tBLA
BUSY LOW from Address Match
tBHA
BUSY HIGH from Address Mismatch
tBLC
BUSY LOW from CE LOW
tBHC
BUSY HIGH from CE HIGH
tPS
Port Set-up for Priority
tWB
R/W HIGH after BUSY (Slave)
tWH
R/W HIGH after BUSY HIGH (Slave)
tBDD[26]
BUSY HIGH to Data Valid
Interrupt Timing[25]
tINS
INT Set Time
tINR
INT Reset Time
Semaphore Timing
tSOP
tSWRD
tSPS
tSAA
SEM Flag Update Pulse (OE or SEM)
SEM Flag Write to Read Time
SEM Flag Contention Window
SEM Address Access Time
CY7C024AV/025AV/026AV
CY7C0241AV/0251AV/036AV
-20
-25
Min.
Max.
Min.
Max.
Unit
15
15
ns
0
0
ns
12
15
ns
3
0
ns
45
50
ns
30
35
ns
20
20
ns
20
20
ns
20
20
ns
17
17
ns
5
5
ns
0
0
ns
15
17
ns
20
25
ns
20
20
ns
20
20
ns
10
12
ns
5
5
ns
5
5
ns
20
25
ns
Data Retention Mode
The CY7C024AV/025AV/026AV and CY7C0241AV/0251AV/
036AV are designed with battery backup in mind. Data
retention voltage and supply current are guaranteed over
temperature. The following rules ensure data retention:
1. Chip Enable (CE) must be held HIGH during data retention,
within VCC to VCC – 0.2V.
2. CE must be kept between VCC – 0.2V and 70% of VCC
during the power-up and power-down transitions.
3. The RAM can begin operation >tRC after VCC reaches the
minimum operating voltage (3.0V).
Timing
VCC
CE
Data Retention Mode
3.0V
VCC > 2.0V
3.0V
tRC
VCC to VCC – 0.2V
VIH
Parameter
ICCDR1
Test Conditions[27]
@ VCCDR = 2V
Notes:
24. For information on port-to-port delay through RAM cells from writing port to reading port, refer to Read Timing with Busy waveform.
25. Test conditions used are Load 2.
26. tBDD is a calculated parameter and is the greater of tWDD – tPWE (actual) or tDDD – tSD (actual).
27. CE = VCC, Vin = GND to VCC, TA = 25°C. This parameter is guaranteed but not tested.
Max.
50
Unit
μA
Document #: 38-06052 Rev. *H
Page 10 of 19

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