CDB5340 Просмотр технического описания (PDF) - Cirrus Logic
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Компоненты Описание
производитель
CDB5340 Datasheet PDF : 22 Pages
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Confidential Draft
3/11/08
6. PACKAGE DIMENSIONS
16L TSSOP (4.4 mm BODY) PACKAGE DRAWING
N
CS5340
D
E11
E
A2
A
1 23
TOP VIEW
DIM
MIN
A
--
A1
0.002
A2
0.03346
b
0.00748
D
0.193
E
0.248
E1
0.169
e
--
L
0.020
µ
0°
e
b2
SIDE VIEW
INCHES
NOM
--
0.004
0.0354
0.0096
0.1969
0.2519
0.1732
0.026 BSC
0.024
4°
MAX
0.043
0.006
0.037
0.012
0.201
0.256
0.177
--
0.028
8°
A1
L
SEATING
PLANE
END VIEW
MILLIMETERS
MIN
NOM
MAX
--
--
1.10
0.05
--
0.15
0.85
0.90
0.95
0.19
0.245
0.30
4.90
5.00
5.10
6.30
6.40
6.50
4.30
4.40
4.50
--
0.65 BSC
--
0.50
0.60
0.70
0°
4°
8°
∝
NOTE
2,3
1
1
JEDEC #: MO-153
Controlling Dimension is Millimeters
1. “D” and “E1” are reference datums and do not included mold flash or protrusions, but do include mold
mismatch and are measured at the parting line, mold flash or protrusions shall not exceed 0.20 mm per
side.
2. Dimension “b” does not include dambar protrusion/intrusion. Allowable dambar protrusion shall be
0.13 mm total in excess of “b” dimension at maximum material condition. Dambar intrusion shall not re-
duce dimension “b” by more than 0.07 mm at least material condition.
3. These dimensions apply to the flat section of the lead between 0.10 and 0.25 mm from lead tips.
THERMAL CHARACTERISTICS
Parameter
Allowable Junction Temperature
Junction to Ambient Thermal Impedance
Symbol Min Typ Max Unit
-
-
135
°C
θJA
-
75
-
°C/W
DS601F2
21
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