BGA2715 Просмотр технического описания (PDF) - NXP Semiconductors.
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BGA2715 Datasheet PDF : 15 Pages
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NXP Semiconductors
BGA2715
MMIC wideband amplifier
30 mm
PH
30 mm
IN
PHILIPS
OUT
V+
PH
IN
PHILIPS
DUT C3
C2
C1
OUT
V+
001aab255
Material = FR4, thickness = 0.6 mm, r = 4.6.
Fig 2. PCB layout and demonstration board showing components.
8.1 Grounding and output impedance
If the grounding is not optimal, the gain becomes less flat and the 50 output matching
becomes worse. To further increase output matching to 50 , a 12 resistor (R1) can be
placed in series with C3 (see Figure 3). This will significantly improve the output
impedance, at the cost of 1 dB gain and 1 dB output power.
BGA2715
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 12 September 2011
© NXP B.V. 2011. All rights reserved.
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