BGA461 Просмотр технического описания (PDF) - Infineon Technologies

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BGA461

Silicon Germanium GPS Low Noise Amplifier

Infineon Technologies 

5

Package Information

BGA461

Package Information

Top view

0.4 +0.1

0.05 MAX.

Bottom view

1.5 ±0.05

1.1±0.05

4

56

1.4 ±0.035 1)

7

Pin 1 marking

3

2

1

6 x 0.3 ±0.035 1)

Figure 3

1) Dimension applies to plated terminal

Package Dimensions for TSLP-7-4 (top, side and bottom view)

TSLP-7-4-PO V03

NSMD

1.4

1.4

SMD

1.4

1.4

0.3

0.3

0.3

Copper Solder mask

0.25

0.25

Stencil apertures

Figure 4 Footprint TSLP-7-4

4

0.3

0.3

0.3

Copper Solder mask

0.25

0.25

Stencil apertures

TSLP-7-4-FP V01

0.5

Figure 5

Pin 1

1.65

marking

TSLP-7-4-TP V05

Tape & Reel Dimensions (Ø reel 330, pieces/reel 7500)

Preliminary Data Sheet

8

Rev.1.1, 2009-01-22

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