Features
• Low Forward Voltage Drop
• Fast Switching
• Ultra-Small Surface Mount Package
• PN Junction Guard Ring for Transient and ESD Protection
• Lead Free/RoHS Compliant (Note 3)
• "Green" Device (Note 4 and 5)
BAT54JW
SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAY
Please click here to visit our online spice models database.
Mechanical Data
• Case: SOT-363
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
• Orientation: See Diagram
• Marking Information: See Page 3
• Ordering Information: See Page 3
• Weight: 0.006 grams (approximate)
Top View
C1
C2
A1
A2
Device Schematic
(Jumper
connection
between
middle pins)
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
30
V
VR
Forward Continuous Current
(Note 1)
IF
200
mA
Repetitive Peak Forward Current
(Note 1)
IFRM
300
mA
Forward Surge Current
(Note 1)
@ t < 1.0s
IFSM
600
mA
Thermal Characteristics
Characteristic
Power Dissipation
Thermal Resistance, Junction to Ambient Air
Operating and Storage Temperature Range
(Note 1)
(Note 1)
Symbol
PD
RθJA
TJ, TSTG
Value
200
625
-65 to +125
Unit
mW
°C/W
°C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage
Forward Voltage
Reverse Leakage Current
Total Capacitance
Reverse Recovery Time
Symbol Min
(Note 2) V(BR)R
30
VF
⎯
(Note 2)
IR
⎯
CT
⎯
trr
⎯
Typ Max Unit
Test Condition
⎯
⎯
V IR = 100μA
240
IF = 0.1mA
320
IF = 1mA
⎯
400
mV IF = 10mA
500
1000
IF = 30mA
IF = 100mA
⎯
2.0
μA VR = 25V
⎯
10
pF VR = 1.0V, f = 1.0MHz
⎯
5.0
ns IF = 10mA through IR = 10mA
to IR = 1.0mA, RL = 100Ω
Notes:
1. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
BAT54JW
Document number: DS30157 Rev. 11 - 2
1 of 3
www.diodes.com
July 2008
© Diodes Incorporated