AQY212GHAX Просмотр технического описания (PDF) - Matsushita Electric Works
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AQY212GHAX Datasheet PDF : 6 Pages
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Cautions for Use
SAFETY WARNINGS
• Do not use the product under conditions
that exceed the range of its specifications.
It may cause overheating, smoke, or fire.
• Do not touch the recharging unit while
the power is on. There is a danger of
electrical shock. Be sure to turn off the
power when performing mounting,
maintenance, or repair operations on the
relay (including connecting parts such as
the terminal board and socket).
AQY212GH
• Check the connection diagrams in the
catalog and be sure to connect the
terminals correctly. Erroneous
connections could lead to unexpected
operating errors, overheating, or fire.
NOTES
1. Short across terminals
Do not short circuit between terminals
when relay is energized. There is
possibility of breaking the internal IC.
2. Surge voltages at the input
If reverse surge voltages are present at
the input terminals, connect a diode in
reverse parallel across the input terminals
and keep the reverse voltages below the
reverse breakdown voltage.
1
4
2
3
3. Recommended LED forward current
(IF)
It is recommended that the LED forward
current (IF) be kept at 5mA.
4. Ripple in the input power supply
If ripple is present in the input power
supply, observe the following:
1) For LED operate current at Emin,
maintain the value mentioned in the table
of “Note 3. Recommended LED forward
current (IF).”
2) Keep the LED operate current at 50
mA or less at Emax.
Emin.
Emax.
5. Output spike voltages
1) If an inductive load generates spike
voltages which exceed the absolute
maximum rating, the spike voltage must
be limited.
Typical circuits are shown below.
1
4
Load
2
3
Add a clamp diode
to the load
1
4
Load
2
3
Add a CR snubber
circuit to the load
2) If spike voltages generated at the load
are limited with a clamp diode and the
circuit wires are long, spike voltages will
occur by inductance. Keep wires as short
as possible to minimize inductance.
6. Cleaning solvents compatibility
Dip cleaning with an organic solvent is
recommended for removal of solder flux,
dust, etc. Select a cleaning solvent from
the following table. If ultrasonic cleaning is
used, the severity of factors such as
frequency, output power and cleaning
solvent selected may cause loose wires
and other defects. Make sure these
conditions are correct before use. For
details, please consult us.
Cleaning solvent
Compatibility
(r: Yes !: No)
Chlorine- • Trichlene
base
• Chloroethlene
r
• Indusco
Adueous • Hollis
r
• Lonco Terg
Alcohol- • IPA
base
• Ethanol
r
Others
• Thinner
• Gasoline
!
7. Soldering
1) When soldering PC board terminals,
keep soldering time to within 10 s at
260°C 500°F.
(1) IR (Infrared reflow) soldering method
T3
T2
T1
2) When soldering surface-mount
terminals, the following conditions are
recommended.
(2) Vapor phase soldering method
T2
T1
(3) Double wave soldering method
T2
T1
t1
t2
T1 = 155 to 165°C 311 to 329°F
T2 = 180°C 200°C 356 to 392°F
T3 = 245°C 473°F or less
t1 = 120 s or less
t2 = 30 s or less
(4) Soldering iron method
Tip temperature: 280 to 300°C 536 to
572°F
Wattage: 30 to 60 W
Soldering time: within 5 s
t1
t2
T1 = 180 to 200°C 366 to 392°F
T2 = 215°C 419°F or less
t1 = 40 s
t2 = 90 s or less
t1
t2 t3
T1 = 155 to 165°C 311 to 329°F
T2 = 260°C 500°F or less
t1 = 60 s or less
t2+t3 = 5 s or less
(5) Others
Check mounting conditions before using
other soldering methods (hot-air, hot
plate, pulse heater, etc.)
• The temperature profile indicates the
temperature of the soldered terminal on
the surface of the PC board. The ambient
temperature may increase excessively.
Check the temperature under mounting
conditions.
• The conditions for the infrared reflow
soldering apply when preheating using
the VPS method.
5
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