AQV112KLAZ Просмотр технического описания (PDF) - Matsushita Electric Works

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AQV112KLAZ

PhotoMOS RELAYS

Matsushita Electric Works 

AQY2/AQV1

CAUTIONS FOR USE

1. Surge voltages at the input

If reverse surge voltages are present at

the input terminals, connect a diode in

reverse parallel across the input terminals

and keep the reverse voltages below the

reverse breakdown voltage.

1

4

2

3

2. Unused terminals

The No. 3 and 5 terminal is used with the

circuit inside the relay. Therefore, do not

connect it to the external circuitry with

either connection method A, B or C. (Non-

latch type)

3. It is possible that in-rush current will

be detected as short current, and

oscillation will be initiated. Please

confirm before use.

4. Please avoid exposing the unit to

short status for longer than 24 hours.

Long periods of exposure to short

status could damage the internal IC

(non-latch type only).

5. Short across terminals

Do not short circuit between terminals

when relay is energized. There is

possibility of breaking the internal IC.

6. Output spike voltages

1) If an inductive load generates spike

voltages which exceed the absolute

maximum rating, the spike voltage must

be limited. Typical circuits are shown

below.

Latch type

1

4

Load

2

3

Add a clamp diode

to the load

1

4

Load

2

3

Add a CR snubber

circuit to the load

Non-latch type

1

6

2

5

Load

3

4

Add a clamp diode

to the load

2) If spike voltages generated at the load

are limited with a clamp diode and the

circuit wires are long, spike voltages will

occur by inductance. Keep wires as short

as possible to minimize inductance.

7. Ripple in the input power supply

If ripple is present in the input power

supply, observe the following:

2) Keep the LED operate current at Emin,

maintain min. 5 mA (Latch type), 10 mA

(Non-latch type).

1) For LED operate current 50 mA or less

at Emax.

Emin.

Emax.

8. When soldering terminals, keep

soldering time to within 10 s at 260°C

500°F.

9. Cleaning solvents compatibility

The PhotoMOS relay forms an optical

path by coupling a light-emitting diode

(LED) and photodiode via transparent

silicon resin. For this reason, unlike other

directory element molded resin products

(e.g., MOS transistors and bipolar

transistors), avoid ultrasonic cleansing if

at all possible. We recommend cleaning

with an organic solvent. If you cannot

avoid using ultrasonic cleansing, please

ensure that the following conditions are

met, and check beforehand for defects.

• Frequency: 27 to 29 kHz

• Ultrasonic output:

No greater than 0.25W/cm2

• Cleaning time:

No longer than 30 s

• Cleanser used: Asahiklin AK-225

• Other:

Submerge in solvent in order to prevent

the PCB and elements from being

contacted directly by the ultrasonic

vibrations.

Note: Applies to unit area ultrasonic output for

ultrasonic baths.

10. Transportation and storage

1) Extreme vibration during transport will

warp the lead or damage the relay.

Handle the outer and inner boxes with

care.

2) Storage under extreme conditions will

cause soldering degradation, external

appearance defects, and deterioration of

the characteristics. The following storage

conditions are recommended:

• Temperature: 0 to 45°C 32 to 113°F

• Humidity: Less than 70% R.H.

• Atomosphere: No harmful gasses such

as sulfurous acid gas, minimal dust.

11. Soldering

1) When soldering PC board terminals,

keep soldering time to within 10 s at

260°C 500°F .

2) When soldering surface-mount

terminals, the following conditions are

recommended.

(1) IR (Infrared reflow) soldering method

T3

T2

T1

t1

t2

T1 = 155 to 165°C 311 to 329°F

T2 = 180°C 200°C 356 to 392°F

T3 = 245°C 473°F or less

t1 = 120 s or less

t2 = 30 s or less

(2) Vapor phase soldering method

T2

T1

t1

t2

T1 = 180 to 200°C 366 to 392°F

T2 = 215°C 419°F or less

t1 = 40 s

t2 = 90 s or less

(3) Double wave soldering method

T2

T1

t1

t2 t3

T1 = 155 to 165°C 311 to 329°F

T2 = 260°C 500°F or less

t1 = 60 s or less

t2+t3 = 5 s or less

(4) Soldering iron method

Tip temperature: 280 to 300°C 536 to

572°F

Wattage: 30 to 60 W

Soldering time: within 5 s

(5) Others

Check mounting conditions before using

other soldering methods (hot-air, hot

plate, pulse heater, etc.)

• The temperature profile indicates the

temperature of the soldered terminal on

the surface of the PC board. The ambient

temperature may increase excessively.

Check the temperature under mounting

conditions.

• The conditions for the infrared reflow

soldering apply when preheating using

the VPS method.

12

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