W981216BH-8H(2000) Просмотр технического описания (PDF) - Winbond

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W981216BH-8H
(Rev.:2000)

2M x 4 BANKS x 16 BIT SDRAM

Winbond 

W981216BH

ABSOLUTE MAXIMUM RATINGS

PARAMETER

Input/Output Voltage

Power Supply Voltage

Operating Temperature

Storage Temperature

Soldering Temperature (10s)

Power Dissipation

Short Circuit Output Current

SYMBOL

VIN, VOUT

VCC, VCCQ

TOPR

TSTG

TSOLDER

PD

IOUT

RATING

-0.3 − VCC +0.3

-0.3 − 4.6

0 − 70

-55 − 150

260

1

50

UNIT

V

V

°C

°C

°C

W

mA

Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability

of the device.

RECOMMENDED DC OPERATING CONDITIONS

(TA = 0 to 70°C)

PARAMETER

SYMBOL

MIN.

Power Supply Voltage

Power Supply Voltage (for I/O

Buffer)

VCC

3.0

VCCQ

3.0

Input High Voltage

Input Low Voltage

VIH

2.0

VIL

-0.3

Note: VIH(max) = VCC/ VCCQ+1.2V for pulse width < 5 nS

VIL(min) = VSS/ VSSQ-1.2V for pulse width < 5 nS

TYP.

3.3

3.3

-

-

MAX.

3.6

3.6

VCC +0.3

0.8

UNIT

V

V

V

V

CAPACITANCE

(VCC = 3.3V, f = 1 MHz, TA = 25°C)

PARAMETER

Input Capacitance

(A0 to A11, BS0, BS1, CS , RAS , CAS , WE , DQM,

CKE)

Input Capacitance (CLK)

Input/Output capacitance

Note: These parameters are periodically sampled and not 100% tested.

SYMBOL

CI

MIN.

-

MAX.

3.8

UNIT

pf

CCLK

CIO

-

3.5

pf

-

6.5

pf

Publication Release Date: October 2000

-5-

Revision A1

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