APL1088 Просмотр технического описания (PDF) - Anpec Electronics
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APL1088 Datasheet PDF : 11 Pages
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APL1088
Physical Specifications
Terminal Material
Lead Solderability
Packaging
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
1000 devices per reel for SOT-89
Reflow Condition (IR/Convection or VPR Reflow)
TP
tp
Critical Zone
R am p-up
TL to TP
TL
tL
Tsmax
T sm in
ts
Preheat
R am p-down
25
t 25 °C to Peak
Classificatin Reflow Profiles
T im e
Profile Feature
Sn-Pb Eutectic Assembly
Large Body
Small Body
Pb-Free Assembly
Large Body
Small Body
Average ramp-up rate
(TL to TP)
3°C/second max.
3°C/second max.
Preheat
- Temperature Min (Tsmin)
100°C
150°C
- Temperature Mix (Tsmax)
- Time (min to max)(ts)
150°C
60-120 seconds
200°C
60-180 seconds
Tsmax to TL
- Ramp-up Rate
3°C/second max
Tsmax to TL
- Temperature(TL)
- Time (tL)
183°C
60-150 seconds
217°C
60-150 seconds
Peak Temperature(Tp)
225 +0/-5°C
240 +0/-5°C
245 +0/-5°C 250 +0/-5°C
Time within 5°C of actual Peak
Temperature(tp)
10-30 seconds
10-30 seconds
10-30 seconds 20-40 seconds
Ramp-down Rate
6°C/second max.
6°C/second max.
Time 25°C to Peak Temperature
6 minutes max.
8 minutes max.
Note: All temperatures refer to topside of the package. Measured on the body surface.
Copyright ANPEC Electronics Corp.
9
Rev. A.1 - Dec., 2000
www.anpec.com.tw
9
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