AMMC-5024 Просмотр технического описания (PDF) - HP => Agilent Technologies
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AMMC-5024 Datasheet PDF : 11 Pages
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Vdd_AUX
DET_Reference
Vdd
DET_Bias
DET_Output
180 415 550 830
1260
GND
2260
1050
960
RF INPUT
235
0
90
RF Output
733
Vg2
510
90
Vg1 2080 2350
Figure 20. AMMC-5024 Bonding Pad Locations. (dimensions in micrometers)
Drain bias must be decoupled from
RF to lowest operating frequency
4 nH Inductor for operation
to 2 GHz bond wire
100 pF Capacitor
VDD
OUT
IN
VG1
Figure 21. AMMC-5024 Assembly Diagram.
Gate is decoupled from RF.
(Bond wire length is not important)
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Data subject to change.
Copyright © 2003 Agilent Technologies, Inc.
August 5, 2003
5988-9884EN
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