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AMMC-5024 Просмотр технического описания (PDF) - HP => Agilent Technologies

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Список матч
AMMC-5024
HP
HP => Agilent Technologies HP
AMMC-5024 Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
The chip is 100 µm thick and
should be handled with care.
This MMIC has exposed air
bridges on the top surface.
Handle at edges or with a custom
collet (do not pick up die with
vacuum on die center.)
This MMIC is also static sensitive
and ESD handling precautions
should be taken.
For more detailed information,
see Agilent Application Note 54
GaAs MMIC ESD, Die Attach
and Bonding Guidelines.
Notes:
1. Ablebond 84-1 LM1 silver
epoxy is recommended.
2. Buckbee-Mears Corporation,
St. Paul, MN, 800-262-3824
Drain Bias
(Vdd)
Vdd AUX
GND
Nine Identical
RF_Input
Figure 19. AMMC-5024 Schematic.
DET_OUT
Second Gate
First Gate
Bias (Vg1)
RF_Output
DET_BIAS
DET_REF
9

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