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ASAHI KASEI
PACKAGE
24pin VSOP (Unit: mm)
*7.8±0.15
24
13
A
[AK4522]
1.25±0.2
1
0.22±0.1
12
0.65
Detail A
Seating Plane
| 0.10
NOTE: Dimension "*" does not include mold flash.
n Package & Lead frame material
Package molding compound: Epoxy
Lead frame material:
Cu
Lead frame surface treatment: Solder plate
0.15±0.05
0.1
0-10°
M0020-E-01
- 17 -
1998/10