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ADP3625 Просмотр технического описания (PDF) - Analog Devices

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ADP3625 Datasheet PDF : 16 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
ADP3623/ADP3624/ADP3625/ADP3633/ADP3634/ADP3635
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
VDD
OUTA, OUTB
DC
<200 ns
INA, INA, INB, INB, and SD
ESD
Human Body Model (HBM)
Field Induced Charged Device Model
(FICDM)
SOIC_N_EP
MINI_SO_EP
θJA, JEDEC 4-Layer Board
SOIC_N_EP1
MINI_SO_EP1
Junction Temperature Range
Storage Temperature Range
Lead Temperature
Soldering (10 sec)
Vapor Phase (60 sec)
Infrared (15 sec)
Rating
−0.3 V to +20 V
−0.3 V to VDD + 0.3 V
−2 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
3.5 kV
1.5 kV
1.0 kV
59°C/W
43°C/W
−40°C to +150°C
−65°C to +150°C
300°C
215°C
260°C
1 θJA is measured per JEDEC standards, JESD51-2, JESD51-5, and JESD51-7, as
appropriate with the exposed pad soldered to the PCB.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. A | Page 6 of 16

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