ADP1708ARDZ-R7 Просмотр технического описания (PDF) - Analog Devices
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ADP1708ARDZ-R7 Datasheet PDF : 20 Pages
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ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
IN to GND
OUT to GND
EN to GND
SS/ADJ/TRK to GND
SENSE to GND
Storage Temperature Range
Operating Junction Temperature Range
Soldering Conditions
Rating
−0.3 V to +6 V
–0.3 V to IN
–0.3 V to +6 V
–0.3 V to +6 V
–0.3 V to +6 V
–65°C to +150°C
–40°C to +125°C
JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ADP1706/ADP1707/ADP1708
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
θJA
8-Lead SOIC (Exposed Paddle)
58
8-Lead 3 mm × 3 mm LFCSP (Exposed Paddle) 66
Unit
°C/W
°C/W
ESD CAUTION
Rev. 0 | Page 5 of 20
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