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ADP1051 Просмотр технического описания (PDF) - Analog Devices

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ADP1051 Datasheet PDF : 108 Pages
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Data Sheet
ADP1051
Pin No. Mnemonic
17
PG/ALT
18
VCORE
19
VDD
20
AGND
21
RES
22
ADD
23
RTD
24
OVP
EP
Description
Power Good Output (Open Drain). Connect this pin to VDD through a pull-up resistor (typically 2.2 kΩ).This signal
is referred to AGND. This pin is also used as an SMBus ALERT signal. (For information about the SMBus specification,
see the PMBus Features section.)
Output of 2.6 V Regulator. Connect a decoupling capacitor of at least 330 nF from this pin to AGND, as close as
possible to the ADP1051, minimizing the PCB trace length. It is recommended that this pin not be used as a
reference or to generate other logic levels using resistive dividers.
Positive Supply Input. Voltage of 3.0 V to 3.6 V. This signal is referred to AGND. Connect a 2.2 μF decoupling
capacitor from this pin to the AGND, as close as possible to the ADP1051, minimizing the PCB trace length.
Common Analog Ground. The internal analog circuitry ground and digital circuitry ground is star connected to
this pin through bonding wires.
Resistor Input. This pin sets up the internal reference for the internal PLL frequency. Connect a 10 kΩ resistor
(±0.1%) from this pin to AGND. This signal is referred to AGND.
Address Select Input. This pin is used to program the I2C/PMBus address. Connect a resistor from ADD to AGND.
This signal is referred to AGND.
Thermistor Input. Place a thermistor (R25 = 100 kΩ (1%), beta = 4250 (1%)) in parallel with a 16.5 kΩ (1%) resistor
and a 1 nF filtering capacitor. This pin is referred to AGND. Connect this pin to AGND if not in use.
Overvoltage Protection. This signal is used as redundant overvoltage protection. This signal is referred to AGND.
Exposed Pad. The ADP1051 has an exposed thermal pad on the underside of the package. For increased reliability
of the solder joints and maximum thermal capability, it is recommended that the exposed pad be soldered to the
PCB AGND plane.
Rev. B | Page 11 of 108

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