ADM1031ARQZ-REEL(2012) Просмотр технического описания (PDF) - ON Semiconductor

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ADM1031ARQZ-REEL
(Rev.:2012)

Intelligent Temperature Monitor and Dual PWM Fan Controller

ON Semiconductor 

ADM1031

PWM_OUT1 1

PWM_OUT2 3

TACH2/AIN2 4

TACH1/AIN1 2

D1+ 10

D1− 9

D2+ 12

D2− 11

VCC

6

ADM1031

SLAVE

ADDRESS

REGISTER

FAN FILTER

REGISTER

PWM

CONTROLLERS

FAN

CHARACTERISTICS

REGISTER

FAN

CONFIG

REGISTER

TACH SIGNAL

CONDITIONING

FAN SPEED

COUNTER

SERIAL BUS

INTERFACE

ADDRESS

STATUS

REGISTERS

INTERRUPT

STATUS

REGISTERS

LIMIT

COMPARATOR

VALUE & LIMIT

REGISTERS

BANDGAP

TEMPERATURE

SENSOR

ANALOG

MULTIPLEXER

ADC

2.5 V

BANDGAP

REFERENCE

5

GND

OFFSET

REGISTERS

CONFIGURATION

REGISTERS

Figure 1. Functional Block Diagram

13 ADD

15 SDA

16 SCL

14 INT

(SMBALERT)

7 THERM

8 FAN_FAULT

Table 1. ABSOLUTE MAXIMUM RATINGS

Parameter

Rating

Unit

Positive Supply Voltage (VCC)

Voltage on Any Input or Output Pin

Input Current at Any Pin

6.5

V

−0.3 to +6.5

V

5

mA

Package Input Current

20

mA

Maximum Junction Temperature (TJ max)

Storage Temperature Range

Lead Temperature, Soldering

Vapor Phase (60 sec)

Infrared (15 sec)

150

C

−65 to +150

C

C

215

200

ESD Rating − All Pins

2000

V

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.

Table 2. THERMAL CHARACTERISTICS

Package Type

qJA

qJC

Unit

16-lead QSOP

105

39

C/W

NOTE: qJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages.

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