ADL5544 Просмотр технического описания (PDF) - Analog Devices

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ADL5544

30 MHz to 6 GHz RF/IF Gain Block

Analog Devices 

Data Sheet

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Supply Voltage, VPOS

Input Power (50 Ω Impedance)

Internal Power Dissipation

(Pad Soldered to Ground)

Maximum Junction Temperature

Operating Temperature Range

Storage Temperature Range

Rating

6.5 V

18 dBm

400 mW

150°C

−40°C to +105°C

−65°C to +150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ADL5544

THERMAL RESISTANCE

Table 4 lists the junction-to-air thermal resistance (θJA) and the

junction-to-case thermal resistance (θJC) for the ADL5544.

Table 4. Thermal Resistance

Package Type

θJA1

θJC2

Unit

3-Lead SOT-89 (RK-3)

53

15

°C/W

1 Measured on the ADL5544 evaluation board. For more information about

board layout, see the Soldering Information and Recommended PCB Land

Pattern section.

2 Based on simulation with a standard JEDEC board per JESD51.

ESD CAUTION

Rev. 0 | Page 7 of 20

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