ADJD-S312-CR999 Просмотр технического описания (PDF) - Avago Technologies

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ADJD-S312-CR999

Miniature Surface-Mount RGB Digital Color Sensor

Avago Technologies 

Recommended PCB land pad design

• NiAu flash over copper pad

• Pad Diameter (C)= 0.20 mm

• NSMD Diameter (D)= 0.25 ~ 0.30 mm

NSMD

After soldering or mounting precaution

Please ensure that all soldered or reflowed CSP package

that is mounted on the PCB is not exposed to compres-

sion or loading force directly perpendicular to the flat

top surface.

Precaution:

Excessive loading force directly perpendicular to the flat

top surface may cause pre-mature failure.

Loading Force

PCB

Recommended Stencil Design

• Stencil thickness

5 mils

• Stencil type

Ni Electroforming

• Stencil Aperture Type Square

• Stencil Aperture

310 um

• Additional Feature

Rounded square edge

310 um

560 um

15

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