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ADJD-S312-CR999 Просмотр технического описания (PDF) - Avago Technologies

Номер в каталоге
Компоненты Описание
производитель
ADJD-S312-CR999
AVAGO
Avago Technologies AVAGO
ADJD-S312-CR999 Datasheet PDF : 18 Pages
First Prev 11 12 13 14 15 16 17 18
Recommended Underfill Type and Characteristic
Low moisture absorption type
Total height of underfill from PCB plane to cover up 70 – 85 %
Underfill to cover all 4 side of the package
Height
70 ~ 85%
Underfill PCB
Recommended Reflow Profile
It is recommended that Henkel Pb-free solder paste LF310 be used for soldering ADJD-S312-CR999. Below is the
recommended reflow profile.
T-peak 240 ± 5°C
T-reflow 217~220 °C
T-max. 180°C
T-min. 160°C
Delta-Ramp
max. 1 °C/sec.
Delta-Flux
max. 2 °C/sec.
Delta-Cooling
max. 2 °C/sec.
t-comp
100 ~ 140 sec.
t-pre
TIME
90 ~ 120 sec.
t-reflow
14

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