ADG725 Просмотр технического описания (PDF) - Analog Devices
Номер в каталоге
Компоненты Описание
Список матч
ADG725 Datasheet PDF : 16 Pages
| |||
ADG725/ADG731
ABSOLUTE MAXIMUM RATINGS1
(TA = 25°C, unless otherwise noted.)
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . .–0.3 V to +7 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . .+0.3 V to –7 V
Analog Inputs2 . . . . . . . . . . . . . . VSS – 0.3 V to VDD + 0.3 V or
30 mA, Whichever Occurs First
Digital Inputs2 . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V or
30 mA, Whichever Occurs First
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 mA
(Pulsed at 1 ms, 10% Duty Cycle max)
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Thermal Impedance (4-Layer Board)
48-lead LFCSP . . . . . . . . . . . . . . . . . . . . . . . . . . . 25°C/W
48-lead TQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . 54.6°C/W
Lead Temperature, Soldering (10 seconds) . . . . . . . . . . 300°C
IR Reflow, Peak Temperature (<20 seconds) . . . . . . . . 235°C
NOTES
1 Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2 Overvoltages at SCLK, SYNC, DIN, S, or D will be clamped by internal diodes.
Current should be limited to the maximum ratings given.
Model
ADG725BCP
ADG725BCP-REEL
ADG725BCP-REEL7
ADG725BSU
ADG725BSU-REEL
ADG731BCP
ADG731BCP-REEL
ADG731BCP-REEL7
ADG731BSU
ADG731BSU-REEL
ORDERING GUIDE
Temperature Range
–40oC to +85oC
–40oC to +85oC
–40oC to +85oC
–40oC to +85oC
–40oC to +85oC
–40oC to +85oC
–40oC to +85oC
–40oC to +85oC
–40oC to +85oC
–40oC to +85oC
Package Description
Lead Frame Chip-Scale Package (LFCSP)
Lead Frame Chip-Scale Package (LFCSP)
Lead Frame Chip-Scale Package (LFCSP)
Thin Plastic Quad Flat Package (TQFP)
Thin Plastic Quad Flat Package (TQFP)
Lead Frame Chip-Scale Package (LFCSP)
Lead Frame Chip-Scale Package (LFCSP)
Lead Frame Chip-Scale Package (LFCSP)
Thin Plastic Quad Flat Package (TQFP)
Thin Plastic Quad Flat Package (TQFP)
Package Option
CP-48
CP-48
CP-48
SU-48
SU-48
CP-48
CP-48
CP-48
SU-48
SU-48
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADG725/ADG731 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
–6–
REV. A
Share Link: 