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EV-ADF4159EB3Z Просмотр технического описания (PDF) - Analog Devices

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EV-ADF4159EB3Z Datasheet PDF : 36 Pages
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ADF4159
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, GND = AGND = DGND = SDGND = CPGND =
0 V, unless otherwise noted.
Table 4.
Parameter
AVDD to GND
DVDD to GND
VP to GND
VP to AVDD
Digital I/O Voltage to GND
Analog I/O Voltage to GND
REFIN to GND
RFIN to GND
Operating Temperature Range,
Industrial
Storage Temperature Range
Maximum Junction Temperature
Reflow Soldering
Peak Temperature
Time at Peak Temperature
ESD
Charged Device Model
Human Body Model
Rating
−0.3 V to +3.9 V
−0.3 V to +2.4 V
−0.3 V to +3.9 V
−0.3 V to +0.3 V
−0.3 V to DVDD + 0.3 V
−0.3 V to AVDD + 0.3 V
−0.3 V to DVDD + 0.3 V
−0.3 V to AVDD + 0.3 V
−40°C to +125°C
−65°C to +125°C
150°C
260°C
40 sec
1000 V
3000 V
Data Sheet
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Thermal impedance (θJA) is specified for a device with the
exposed pad soldered to AGND.
Table 5. Thermal Resistance
Package Type
θJA
24-Lead LFCSP_WQ
30.4
Unit
°C/W
ESD CAUTION
Rev. B | Page 6 of 36

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