AD7891 Просмотр технического описания (PDF) - Analog Devices
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AD7891 Datasheet PDF : 20 Pages
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AD7891
Parameter
A Version1 B Version Y Version Unit
Test Conditions/Comments
LOGIC OUTPUTS
Output High Voltage, VOH
Output Low Voltage, VOL
DB11to DB0
Floating-State Leakage Current
Floating-State Capacitance5
Output Coding
4.0
4.0
4.0
0.4
0.4
0.4
± 10
± 10
± 10
15
15
15
Straight (Natural) Binary
Twos Complement
V min
V max
mA max
pF max
ISOURCE = 200 mA.
ISINK = 1.6 mA.
Data format bit of control register = 0.
Data format bit of control register = 1.
CONVERSION RATE
Conversion Time
1.6
1.6
1.6
ms max
Track/Hold Acquisition Time
0.6
0.6
0.6
ms max
AD7891-1 hardware conversion.
0.7
0.7
0.7
ms max
AD7891-1 software conversion.
0.4
0.4
0.4
ms max
AD7891-2.
POWER REQUIREMENTS
VDD
IDD
Normal Mode
Standby Mode
Power Dissipation
Normal Mode
Standby Mode
5
5
5
V nom
± 5% for specified performance.
20
20
21
mA max
80
80
80
mA max
Logic inputs = 0 V or VDD.
VDD = 5 V.
100
100
105
mW max
Typically 82 mW.
400
400
400
mW max
Typically 75 mW.
NOTES
1Temperature ranges for the A and B Versions: –40∞C to +85∞C. Temperature range for the Y Version: –55∞C to +105∞C.
2The AD7891-1’s dynamic performance (THD and SNR) and the AD7891-2’s THD are measured with an input frequency of 10 kHz. The AD7891-2’s SNR is
evaluated with an input frequency of 100 kHz.
3This throughput rate can only be achieved when the part is operated in the parallel interface mode. Maximum achievable throughput rate in the serial interface mode
is 357 kSPS.
4See the Terminology section.
5Sample tested during initial release and after any redesign or process change that may affect this parameter.
6REF IN must be buffered before being applied to VINXB.
Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS*
(TA = 25∞C, unless otherwise noted)
VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Analog Input Voltage to AGND
AD7891-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 17 V
AD7891-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . –5 V, +10 V
Reference Input Voltage to AGND . . . . –0.3 V to VDD + 0.3 V
Digital Input Voltage to DGND . . . . . . –0.3 V to VDD + 0.3 V
Digital Output Voltage to DGND . . . . . –0.3 V to VDD + 0.3 V
Operating Temperature Range
Commercial (A, B Versions) . . . . . . . . . . . –40∞C to +85∞C
Automotive (Y Version) . . . . . . . . . . . . . . –55∞C to +105∞C
Storage Temperature Range . . . . . . . . . . . . –65∞C to +150∞C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150∞C
MQFP Package, Power Dissipation . . . . . . . . . . . . . . 450 mW
qJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 95∞C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215∞C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220∞C
PLCC Package, Power Dissipation . . . . . . . . . . . . . . 500 mW
qJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 55∞C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215∞C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220∞C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7891 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
REV. D
–3–
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