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AD6650 Просмотр технического описания (PDF) - Analog Devices

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AD6650 Datasheet PDF : 45 Pages
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AD6650
ABSOLUTE MAXIMUM RATINGS
Table 7.
Parameter
Supply Voltage
Input Voltage
Output Voltage Swing
Load Capacitance
Junction Temperature Under Bias
Storage Temperature Range
Lead Temperature (5 sec)
Rating
−0.3 V to +3.6 V
−0.3 V to +3.6 V
−0.3 V to VDDIO + 0.3 V
200 pF
125°C
−65°C to +150°C
280°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
121-lead chip scale package ball grid array:
θJA = 22.8°C/W, no airflow, measurements made in the
horizontal position on a 4-layer board.
θJA = 20.2°C/W, 200 LFPM airflow, measurements made in the
horizontal position on a 4-layer board.
θJA = 20.7°C/W, no airflow, soldered on an 8-layer board with
two layers dedicated as ground planes.
ESD CAUTION
Rev. A | Page 10 of 44

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