74LVC3G34DC(2007) Просмотр технического описания (PDF) - NXP Semiconductors.

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Компоненты Описание

Список матч

74LVC3G34DC
(Rev.:2007)

Triple buffer

NXP Semiconductors. 

NXP Semiconductors

74LVC3G34

Triple buffer

VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm

SOT765-1

D

y

Z

8

5

pin 1 index

E

c

HE

A A2

A1

1

e

4

bp

wM

detail X

A

X

vM A

Q

(A3)

θ

Lp

L

0

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT

A

max.

A1

A2

A3

bp

c

D(1) E(2)

e

HE

mm

1

0.15

0.00

0.85

0.60

0.12

0.27

0.17

0.23

0.08

2.1

1.9

2.4

2.2

0.5

3.2

3.0

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE

VERSION

IEC

SOT765-1

REFERENCES

JEDEC

JEITA

MO-187

L

Lp

Q

v

w

y

Z(1)

θ

0.4

0.40 0.21

0.15 0.19

0.2

0.13

0.1

0.4

0.1

8°

0°

EUROPEAN

PROJECTION

ISSUE DATE

02-06-07

Fig 10. Package outline SOT765-1 (VSSOP8)

74LVC3G34_5

Product data sheet

Rev. 05 — 5 October 2007

© NXP B.V. 2007. All rights reserved.

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