74AHC30BQ Просмотр технического описания (PDF) - NXP Semiconductors.

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Компоненты Описание

Список матч

74AHC30BQ

8-input NAND gate

NXP Semiconductors. 

NXP Semiconductors

74AHC30; 74AHCT30

8-input NAND gate

12. Package outline

SO14: plastic small outline package; 14 leads; body width 3.9 mm

SOT108-1

D

y

Z

14

pin 1 index

1

e

E

A

X

c

HE

vM A

8

A2

A1

7

bp

wM

Q

(A 3)

A

θ

Lp

L

detail X

0

2.5

5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

UNIT max. A1

A2

A3

bp

c

D(1) E(1)

e

HE

L

Lp

Q

v

w

y

Z (1)

θ

mm

1.75

0.25

0.10

1.45

1.25

0.25

0.49

0.36

0.25

0.19

8.75

8.55

4.0

3.8

1.27

6.2

5.8

1.05

1.0

0.4

0.7

0.6

0.25 0.25

0.1

0.7

0.3

8o

inches

0.069

0.010

0.004

0.057

0.049

0.01

0.019 0.0100 0.35

0.014 0.0075 0.34

0.16

0.15

0.05

0.244

0.228

0.041

0.039

0.016

0.028

0.024

0.01

0.01

0.004

0.028

0.012

0o

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

OUTLINE

VERSION

SOT108-1

IEC

076E06

REFERENCES

JEDEC

JEITA

MS-012

EUROPEAN

PROJECTION

ISSUE DATE

99-12-27

03-02-19

Fig 8. Package outline SOT108-1 (SO14)

74AHC_AHCT30_3

Product data sheet

Rev. 03 — 26 June 2009

© NXP B.V. 2009. All rights reserved.

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