74AHC30D Просмотр технического описания (PDF) - NXP Semiconductors.

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74AHC30D

8-input NAND gate

NXP Semiconductors. 

NXP Semiconductors

74AHC30; 74AHCT30

8-input NAND gate

TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm

SOT402-1

D

c

y

Z

14

8

E

A

X

HE

vM A

pin 1 index

1

e

7

bp

wM

A2

A1

Q

(A 3)

A

θ

Lp

L

detail X

0

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT

A

max.

A1

A2

A3

bp

c

D (1) E (2)

e

HE

mm

1.1

0.15

0.05

0.95

0.80

0.25

0.30

0.19

0.2

0.1

5.1

4.9

4.5

4.3

0.65

6.6

6.2

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

OUTLINE

VERSION

IEC

REFERENCES

JEDEC

JEITA

SOT402-1

MO-153

L

Lp

Q

v

w

y

Z (1) θ

1

0.75 0.4

0.50 0.3

0.2 0.13 0.1

0.72

0.38

8o

0o

EUROPEAN

PROJECTION

ISSUE DATE

99-12-27

03-02-18

Fig 9. Package outline SOT402-1 (TSSOP14)

74AHC_AHCT30_3

Product data sheet

Rev. 03 — 26 June 2009

© NXP B.V. 2009. All rights reserved.

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