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RT9173ACS Просмотр технического описания (PDF) - Richtek Technology

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RT9173ACS
Richtek
Richtek Technology Richtek
RT9173ACS Datasheet PDF : 10 Pages
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Use vias to conduct the heat into the
buried or backside of PCB layer .
RT9173CS (SOP-8)
The PCB heat sink copper area should be
solder-painted without masked. This
approaches a “best case” pad heat sink.
Fig. 6 Layout Consideration
To prevent this maximum junction temperature from
being exceeded, the appropriate power plane heat
sink MUST be used. Higher continuous currents or
ambient temperature require additional heatsinking.
RT9173/A
DS9173/A-06 March 2002
www.richtek-ic.com.tw
7

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