HMC309MS8
MICROWAVE CORPORATION
2.4 GHz FRONT-END LNA / SWITCH IC
FEBRUARY 2001
V01.0900
Evaluation PCB for HMC309MS8
1
The circuit board used in the final application should use RF circuit design techniques. Signal lines should have
50 ohm impedance while the package ground leads should be connected directly to the ground plane similar
to that shown above. A sufficient number of VIA holes should be used to connect the top and bottom ground
planes. The evaluation circuit board as shown is available from Hittite upon request.
List of Material
Item
J1, J2, J3
J4, J5, J6
U1
PCB*
Description
PC Mount SMA RF Connector
DC Pins
HMC309MS8 Amplifier
Eval Board 1.5" x 1.55"
*Circuit Board Material: Rogers 4350
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343
1 - 112
Fax: 978-250-3373
Web Site: www.hittite.com