21-0036 Просмотр технического описания (PDF) - Maxim Integrated

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21-0036

I2C Serial Real-Time Clock

Maxim Integrated 

DS1339 I2C Serial Real-Time Clock

HANDLING, PCB LAYOUT, AND ASSEMBLY

The DS1339C package contains a quartz tuning-fork crystal. Pick-and-place equipment may be used, but

precautions should be taken to ensure that excessive shocks are avoided. Ultrasonic cleaning should be avoided

to prevent damage to the crystal.

Avoid running signal traces under the package, unless a ground plane is placed between the package and the

signal line. All N.C. (no connect) pins must be connected to ground.

Moisture-sensitive packages are shipped from the factory dry-packed. Handling instructions listed on the package

label must be followed to prevent damage during reflow. Refer to the IPC/JEDEC J-STD-020B standard for

moisture-sensitive device (MSD) classifications.

PIN CONFIGURATIONS

TOP VIEW

X1

X2

VBACKUP

GND

DS1339

VCC

SQW /INT

SCL

SDA

µSOP

TOP VIEW

SCL

SQW /INT

V CC

N.C.

N.C.

N.C.

N.C.

N.C.

DS1339C

SDA

GND

VBACKUP

N.C.

N.C.

N.C.

N.C.

N.C.

SO (300 mils)

CHIP INFORMATION

PROCESS: CMOS

PACKAGE INFORMATION

For the latest package outline information and land patterns (footprints), go to www.maxim-ic.com/packages.

Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different

suffix character, but the drawing pertains to the package regardless of RoHS status.

PACKAGE TYPE

PACKAGE CODE

OUTLINE NO.

LAND PATTERN NO.

8 µSOP

U8+1

21-0036

90-0092

16 SO

W16#H2

21-0042

90-0107

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