RHR1K160 Просмотр технического описания (PDF) - Intersil

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RHR1K160

1A, 600V Hyperfast Diode

Intersil 

RHR1K160

The transient thermal impedance (ZθJA) is also effected by

various top copper board areas. Figure 14 shows the effect

of copper pad area on the single pulse transient thermal

impedance. Each trace represents a copper pad area in

square inches corresponding to the descending list in the

graph. Spice and SABER thermal models are provided for

each of the listed pad areas.

Copper pad area has no perceivable effect on transient

thermal impedance for pulse widths less than 100ms. For

pulse widths less than 100ms the transient thermal

impedance is determined by the die and package. Therefore,

CTHERM1 through CTHERM5 and RTHERM1 through

RTHERM4 remain constant for each of the thermal models.

A listing of the model component values is available in

Table 1.

150

COPPER BOARD AREA - DESCENDING ORDER

0.049 in2

0.296 in2

0.523 in2

100 0.769 in2

1.000 in2

50

0

10-1

100

101

102

103

t, RECTANGULAR PULSE DURATION (s)

FIGURE 14. TRANSIENT THERMAL IMPEDANCE vs MOUNTING PAD AREA

3-6

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