MAX5813AUD-T Просмотр технического описания (PDF) - Maxim Integrated

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MAX5813AUD-T

Ultra-Small, Quad-Channel, 8-/10-/12-Bit Buffered Output DACs with Internal Reference and I2C Interface

Maxim Integrated 

MAX5813/MAX5814/MAX5815

Ultra-Small, Quad-Channel, 8-/10-/12-Bit Buffered

Output DACs with Internal Reference and I2C Interface

ABSOLUTE MAXIMUM RATINGS

VDD, VDDIO to GND................................................. -0.3V to +6V

OUT_, REF to GND....0.3V to the lower of (VDD + 0.3V) and +6V

SCL, SDA, LDAC, CLR to GND............................... -0.3V to +6V

ADDR_ to GND.............................................-0.3V to the lower of

(VDDIO + 0.3V) and +6V

Continuous Power Dissipation (TA = +70NC)

TSSOP (derate at 10mW/NC above 70NC)....................797mW

WLP (derate at 16.1mW/NC above 70NC)...................1288mW

Maximum Continuous Current into Any Pin..................... Q50mA

Operating Temperature Range......................... -40NC to +125NC

Storage Temperature Range............................. -65NC to +150NC

Lead Temperature (TSSOP only)(soldering, 10s)............+300NC

Soldering Temperature (reflow)..................................... +260NC

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-

tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

PACKAGE THERMAL CHARACTERISTICS (Note 1)

TSSOP

WLP

Junction-to-Ambient Thermal Resistance (θJA) ........100NC/W

Junction-to-Case Thermal Resistance (θJC) ...............30NC/W

Junction-to-Ambient Thermal Resistance (θJA)

(Note 2).........................................................................62NC/W

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

Note 2: Visit www.maximintegrated.com/app-notes/index.mvp/id/1891 for information about the thermal performance of WLP packaging.

ELECTRICAL CHARACTERISTICS

(VDD = 2.7V to 5.5V, VDDIO = 1.8V to 5.5V, VGND = 0V, CL = 200pF, RL = 2kI, TA = -40NC to +125NC, unless otherwise noted. Typical

values are at TA = +25NC.) (Note 3)

PARAMETER

DC PERFORMANCE (Note 4)

Resolution and Monotonicity

Integral Nonlinearity (Note 5)

Differential Nonlinearity (Note 5)

Offset Error (Note 6)

Offset Error Drift

Gain Error (Note 6)

SYMBOL

N

INL

DNL

OE

MAX5813

MAX5814

MAX5815

MAX5813

MAX5814

MAX5815

MAX5813

MAX5814

MAX5815

GE

CONDITIONS

Gain Temperature Coefficient

Zero-Scale Error

Full-Scale Error

With respect to VREF

With respect to VREF

MIN TYP MAX UNITS

8

10

12

-0.25

-0.5

-1

-0.25

-0.5

-1

-5

-1.0

0

-0.5

Q0.05

Q0.25

Q0.5

Q0.05

Q0.1

Q0.2

Q0.5

Q10

Q0.1

Q3.0

+0.25

+0.5

+1

+0.25

+0.5

+1

+5

+1.0

10

+0.5

Bits

LSB

LSB

mV

FV/NC

%FS

ppm of

FS/NC

mV

%FS

Maxim Integrated

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