5962F0252401V9A Просмотр технического описания (PDF) - STMicroelectronics
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5962F0252401V9A Datasheet PDF : 20 Pages
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RHFL4913A
Die information
7.1
Die bonding pad locations and electrical functions
● Die physical dimensions:
– Die size: 150 mils x 110 mils (3.81 mm by 2.79 mm)
– Die thickness: 375 µm ± 25 µm (14.8 mils ± 1 mil)
● Pad size: VIN, VOUT pads: 450 µm x 330 µm (17.7 mils by 13 mils)
– Control pads: 184 µm x 184 µm (7.25 mils square)
● Interface materials:
– Top metallization: Al/Si/Cu, 1.05 µm ± 0.15 µm
– Backside metallization: none
● Passivation:
– Type: p. vapox + nitride
– Thickness: 0.6 µm ± 0.1 µm + 0.6 µm ± 0.08 µm
● Substrate: bare silicon
● Assembly related information:
– Substrate potential: floating recommended to be tied to ground
– Special assembly instructions: "Sense" pad not used; not internally connected to
any part of the IC. Can be connected to ground when space anti-static electricity
rules apply.
Doc ID 10005 Rev 15
13/20
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