AD7607(2016) Просмотр технического описания (PDF) - Analog Devices
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AD7607 Datasheet PDF : 32 Pages
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AD7607
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter
AVCC to AGND
VDRIVE to AGND
Analog Input Voltage to AGND1
Digital Input Voltage to AGND
Digital Output Voltage to AGND
REFIN to AGND
Input Current to Any Pin Except Supplies1
Operating Temperature Range
B Version
Storage Temperature Range
Junction Temperature
Pb/SN Temperature, Soldering
Reflow (10 sec to 30 sec)
Pb-Free Temperature, Soldering Reflow
ESD (All Pins Except Analog Inputs)
ESD (Analog Input Pins Only)
Rating
−0.3 V to +7 V
−0.3 V to AVCC + 0.3 V
±16.5 V
−0.3 V to VDRIVE + 0.3 V
−0.3 V to VDRIVE + 0.3 V
−0.3 V to AVCC + 0.3 V
±10 mA
−40°C to +85°C
−65°C to +150°C
150°C
240 (+ 0)°C
260 (+ 0)°C
2 kV
7 kV
1 Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Data Sheet
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages. These
specifications apply to a 4-layer board.
Table 5. Thermal Resistance
Package Type
θJA
θJC
Unit
64-Lead LQFP
45
11
°C/W
ESD CAUTION
Rev. C | Page 10 of 32
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